EPOXY

EPOXY

TWO PART EPOXY

MANUFACTURED BY EPOXYSET INC, USA

EPOXIBOND-25007 LOW VISCOSITY, HIGH TEMPERATURE ADHESIVE

EPOXYBOND-25007 is unfilled, low viscosity, heat curing, high temperature resistant epoxy adhesive. It maintains high lap shear strength up to 210°C and has excellent thermal and chemical resistance. It can be used for bonding, coating, and sealing applications where a thin film with high insulating resistance is required, particularly at elevated temperatures. It is recommended for bonding metals, glass, and ceramic substrates. It has long pot-life and has an amber color change upon cure.

FEATURES & APPLICATIONS

  • Semiconductor : Wafer to wafer bonding; MEMs devices; flip chip underfill.
  • Hybrid : fiber optic, hermetic seals and high temperature packaging sensors.
  • Fiber Optic : Sealing fiber into ferrules, transmitting light in the optical pathway, Fiber component packaging; adhesive for active alignment of optics, environmental seal of opto-package, V-groove arrays
  • Medical : Potting fiber optic bundles into ferrules for light guides and endoscopes; Capable of resisting several sterilization techniques; Certified USP Class VI for Biocompatibility Standards; adhesive for catheter devices.
  • Electronics Assembly : Used as dielectric layer in the fabrication of capacitors; laminating PZT ferroelectrics; Impregnating windings in motors and inductor coils; Bonding ferrite cores and magnets; Structural adhesive for electronic components
     
No. of Components 2 Hardness(Shore) D-87
Mix Ratio by Weight 100 / 10 Refractive Index 1.56
Mixed Viscosity @RT(cps) 3000-5000 Lap Shear Strength @25°C(psi) 2200
Pot Life @25°C(100 gram) 4-6 hrs Tg(°C) 110
Recommended Cure 5-10 min @ 125°C CTE(Below Tg)10-6/°C 54
Alternate Cure 1-2 min @ 125°C Service Temp.Range -55°C to 250°C
Color Clear/ Amber Thermal Conductivity(W/m°K) NA
Specific Gravity 1.18 Volume Resistivity(500 V) 1.0 x 10^15


INSTRUCTIONS FOR USE

  • Weigh each 10 grams of RESIN (PART-A) to 1 gram of Hardener (PART-B).
  • Mix until uniform. Scrape the sides and bottom of container repeatedly during mixing.
  • Apply to clean bonding surfaces and cure as recommended to achieve the desired properties.
  • Typical cured properties were determined using recommended cure schedule.


AVAILABILITY

  • 2 parts Kit - Packaged in 4gm (Part A) & 0.4gm (Part B) burst seal pouches. Other package size are available on request.
     
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